Masking and etching of silicon and related materials for geometries down to 25 nm

U. Hilleringmann, T. Vieregge, J.T. Horstmann, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.

Download
No fulltext has been uploaded.
Conference Paper | Published | English
Author
Hilleringmann, UlrichLibreCat; Vieregge, T.; Horstmann, J.T.
Department
Publishing Year
Proceedings Title
IECON'99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)
LibreCat-ID

Cite this

Hilleringmann U, Vieregge T, Horstmann JT. Masking and etching of silicon and related materials for geometries down to 25 nm. In: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029). IEEE; 2003. doi:10.1109/iecon.1999.822171
Hilleringmann, U., Vieregge, T., & Horstmann, J. T. (2003). Masking and etching of silicon and related materials for geometries down to 25 nm. IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029). https://doi.org/10.1109/iecon.1999.822171
@inproceedings{Hilleringmann_Vieregge_Horstmann_2003, title={Masking and etching of silicon and related materials for geometries down to 25 nm}, DOI={10.1109/iecon.1999.822171}, booktitle={IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)}, publisher={IEEE}, author={Hilleringmann, Ulrich and Vieregge, T. and Horstmann, J.T.}, year={2003} }
Hilleringmann, Ulrich, T. Vieregge, and J.T. Horstmann. “Masking and Etching of Silicon and Related Materials for Geometries down to 25 Nm.” In IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029). IEEE, 2003. https://doi.org/10.1109/iecon.1999.822171.
U. Hilleringmann, T. Vieregge, and J. T. Horstmann, “Masking and etching of silicon and related materials for geometries down to 25 nm,” 2003, doi: 10.1109/iecon.1999.822171.
Hilleringmann, Ulrich, et al. “Masking and Etching of Silicon and Related Materials for Geometries down to 25 Nm.” IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003, doi:10.1109/iecon.1999.822171.

Export

Marked Publications

Open Data LibreCat

Search this title in

Google Scholar