A Scalable Formal Debugging Approach with Auto-Correction Capability based on Static Slicing and Dynamic Ranking for RTL Datapath Designs
B. Alizadeh, P. Behnam, S. Sadeghi-Kohan, IEEE Transactions on Computers (2014) 1–1.
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Alizadeh, Bijan;
Behnam, Payman;
Sadeghi-Kohan, SomayehLibreCat
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IEEE Transactions on Computers
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Alizadeh B, Behnam P, Sadeghi-Kohan S. A Scalable Formal Debugging Approach with Auto-Correction Capability based on Static Slicing and Dynamic Ranking for RTL Datapath Designs. IEEE Transactions on Computers. Published online 2014:1-1. doi:10.1109/tc.2014.2329687
Alizadeh, B., Behnam, P., & Sadeghi-Kohan, S. (2014). A Scalable Formal Debugging Approach with Auto-Correction Capability based on Static Slicing and Dynamic Ranking for RTL Datapath Designs. IEEE Transactions on Computers, 1–1. https://doi.org/10.1109/tc.2014.2329687
@article{Alizadeh_Behnam_Sadeghi-Kohan_2014, title={A Scalable Formal Debugging Approach with Auto-Correction Capability based on Static Slicing and Dynamic Ranking for RTL Datapath Designs}, DOI={10.1109/tc.2014.2329687}, journal={IEEE Transactions on Computers}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Alizadeh, Bijan and Behnam, Payman and Sadeghi-Kohan, Somayeh}, year={2014}, pages={1–1} }
Alizadeh, Bijan, Payman Behnam, and Somayeh Sadeghi-Kohan. “A Scalable Formal Debugging Approach with Auto-Correction Capability Based on Static Slicing and Dynamic Ranking for RTL Datapath Designs.” IEEE Transactions on Computers, 2014, 1–1. https://doi.org/10.1109/tc.2014.2329687.
B. Alizadeh, P. Behnam, and S. Sadeghi-Kohan, “A Scalable Formal Debugging Approach with Auto-Correction Capability based on Static Slicing and Dynamic Ranking for RTL Datapath Designs,” IEEE Transactions on Computers, pp. 1–1, 2014, doi: 10.1109/tc.2014.2329687.
Alizadeh, Bijan, et al. “A Scalable Formal Debugging Approach with Auto-Correction Capability Based on Static Slicing and Dynamic Ranking for RTL Datapath Designs.” IEEE Transactions on Computers, Institute of Electrical and Electronics Engineers (IEEE), 2014, pp. 1–1, doi:10.1109/tc.2014.2329687.