TCO analysis of a modular and integral product architecture in shipbuilding
T. Seidenberg, J.-P. Disselkamp, C. Jürgenhake, A. Wicker, R. Dumitrescu, E. Tolo, in: 2023.
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Conference Paper
| English
Author
Seidenberg, Tobias;
Disselkamp, Jan-Philipp;
Jürgenhake, Christoph;
Wicker, Ansgar;
Dumitrescu, RomanLibreCat;
Tolo, Edmund
Publishing Year
Conference
IEEE Ice Conference 2023
Conference Location
Edingburgh
Conference Date
2023-06-19 – 2023-06-22
LibreCat-ID
Cite this
Seidenberg T, Disselkamp J-P, Jürgenhake C, Wicker A, Dumitrescu R, Tolo E. TCO analysis of a modular and integral product architecture in shipbuilding. In: ; 2023. doi: 10.1109/ICE/ITMC58018.2023.10332277
Seidenberg, T., Disselkamp, J.-P., Jürgenhake, C., Wicker, A., Dumitrescu, R., & Tolo, E. (2023). TCO analysis of a modular and integral product architecture in shipbuilding. IEEE Ice Conference 2023, Edingburgh. https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277
@inproceedings{Seidenberg_Disselkamp_Jürgenhake_Wicker_Dumitrescu_Tolo_2023, title={TCO analysis of a modular and integral product architecture in shipbuilding}, DOI={ 10.1109/ICE/ITMC58018.2023.10332277}, author={Seidenberg, Tobias and Disselkamp, Jan-Philipp and Jürgenhake, Christoph and Wicker, Ansgar and Dumitrescu, Roman and Tolo, Edmund}, year={2023} }
Seidenberg, Tobias, Jan-Philipp Disselkamp, Christoph Jürgenhake, Ansgar Wicker, Roman Dumitrescu, and Edmund Tolo. “TCO Analysis of a Modular and Integral Product Architecture in Shipbuilding,” 2023. https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277.
T. Seidenberg, J.-P. Disselkamp, C. Jürgenhake, A. Wicker, R. Dumitrescu, and E. Tolo, “TCO analysis of a modular and integral product architecture in shipbuilding,” presented at the IEEE Ice Conference 2023, Edingburgh, 2023, doi: 10.1109/ICE/ITMC58018.2023.10332277.
Seidenberg, Tobias, et al. TCO Analysis of a Modular and Integral Product Architecture in Shipbuilding. 2023, doi: 10.1109/ICE/ITMC58018.2023.10332277.