Broadband acoustic waves in plate-like structures for acoustic material characterisation
L. Claes, S. Johannesmann, H. Zeipert, B. Henning, in: 2023 International Congress on Ultrasonics, Beijing, China, IOP Publishing, 2024, p. 012171.
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2023 International Congress on Ultrasonics, Beijing, China
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2822
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012171
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Claes L, Johannesmann S, Zeipert H, Henning B. Broadband acoustic waves in plate-like structures for acoustic material characterisation. In: 2023 International Congress on Ultrasonics, Beijing, China. Vol 2822. IOP Publishing; 2024:012171. doi:10.1088/1742-6596/2822/1/012171
Claes, L., Johannesmann, S., Zeipert, H., & Henning, B. (2024). Broadband acoustic waves in plate-like structures for acoustic material characterisation. 2023 International Congress on Ultrasonics, Beijing, China, 2822, 012171. https://doi.org/10.1088/1742-6596/2822/1/012171
@inproceedings{Claes_Johannesmann_Zeipert_Henning_2024, title={Broadband acoustic waves in plate-like structures for acoustic material characterisation}, volume={2822}, DOI={10.1088/1742-6596/2822/1/012171}, booktitle={2023 International Congress on Ultrasonics, Beijing, China}, publisher={IOP Publishing}, author={Claes, Leander and Johannesmann, Sarah and Zeipert, Henning and Henning, Bernd}, year={2024}, pages={012171} }
Claes, Leander, Sarah Johannesmann, Henning Zeipert, and Bernd Henning. “Broadband Acoustic Waves in Plate-like Structures for Acoustic Material Characterisation.” In 2023 International Congress on Ultrasonics, Beijing, China, 2822:012171. IOP Publishing, 2024. https://doi.org/10.1088/1742-6596/2822/1/012171.
L. Claes, S. Johannesmann, H. Zeipert, and B. Henning, “Broadband acoustic waves in plate-like structures for acoustic material characterisation,” in 2023 International Congress on Ultrasonics, Beijing, China, 2024, vol. 2822, p. 012171, doi: 10.1088/1742-6596/2822/1/012171.
Claes, Leander, et al. “Broadband Acoustic Waves in Plate-like Structures for Acoustic Material Characterisation.” 2023 International Congress on Ultrasonics, Beijing, China, vol. 2822, IOP Publishing, 2024, p. 012171, doi:10.1088/1742-6596/2822/1/012171.
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