Common-path depth-filtered digital holography for high resolution imaging of buried semiconductor structures

M. Finkeldey, F. Schellenberg, N.C. Gerhardt, C. Paar, M. Hofmann, in: Practical Holography XXX: Materials and Applications, 2016.

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Finkeldey, Markus; Schellenberg, Falk; Gerhardt, Nils ChristopherLibreCat ; Paar, Christof; Hofmann, Martin
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Practical Holography XXX: Materials and Applications
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Finkeldey M, Schellenberg F, Gerhardt NC, Paar C, Hofmann M. Common-path depth-filtered digital holography for high resolution imaging of buried semiconductor structures. In: Practical Holography XXX: Materials and Applications. ; 2016. doi:10.1117/12.2212454
Finkeldey, M., Schellenberg, F., Gerhardt, N. C., Paar, C., & Hofmann, M. (2016). Common-path depth-filtered digital holography for high resolution imaging of buried semiconductor structures. Practical Holography XXX: Materials and Applications. https://doi.org/10.1117/12.2212454
@inproceedings{Finkeldey_Schellenberg_Gerhardt_Paar_Hofmann_2016, title={Common-path depth-filtered digital holography for high resolution imaging of buried semiconductor structures}, DOI={10.1117/12.2212454}, booktitle={Practical Holography XXX: Materials and Applications}, author={Finkeldey, Markus and Schellenberg, Falk and Gerhardt, Nils Christopher and Paar, Christof and Hofmann, Martin}, year={2016} }
Finkeldey, Markus, Falk Schellenberg, Nils Christopher Gerhardt, Christof Paar, and Martin Hofmann. “Common-Path Depth-Filtered Digital Holography for High Resolution Imaging of Buried Semiconductor Structures.” In Practical Holography XXX: Materials and Applications, 2016. https://doi.org/10.1117/12.2212454.
M. Finkeldey, F. Schellenberg, N. C. Gerhardt, C. Paar, and M. Hofmann, “Common-path depth-filtered digital holography for high resolution imaging of buried semiconductor structures,” 2016, doi: 10.1117/12.2212454.
Finkeldey, Markus, et al. “Common-Path Depth-Filtered Digital Holography for High Resolution Imaging of Buried Semiconductor Structures.” Practical Holography XXX: Materials and Applications, 2016, doi:10.1117/12.2212454.

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