FeFET-Based Binarized Neural Networks Under Temperature-Dependent Bit Errors
M. Yayla, S. Buschjager, A. Gupta, J.-J. Chen, J. Henkel, K. Morik, K.-H. Chen, H. Amrouch, IEEE Transactions on Computers 71 (2021) 1681–1695.
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Author
Yayla, Mikail;
Buschjager, Sebastian;
Gupta, Aniket;
Chen, Jian-Jia;
Henkel, Jorg;
Morik, Katharina;
Chen, Kuan-Hsun;
Amrouch, Hussam
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Journal Title
IEEE Transactions on Computers
Volume
71
Issue
7
Page
1681-1695
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Yayla M, Buschjager S, Gupta A, et al. FeFET-Based Binarized Neural Networks Under Temperature-Dependent Bit Errors. IEEE Transactions on Computers. 2021;71(7):1681-1695. doi:10.1109/tc.2021.3104736
Yayla, M., Buschjager, S., Gupta, A., Chen, J.-J., Henkel, J., Morik, K., Chen, K.-H., & Amrouch, H. (2021). FeFET-Based Binarized Neural Networks Under Temperature-Dependent Bit Errors. IEEE Transactions on Computers, 71(7), 1681–1695. https://doi.org/10.1109/tc.2021.3104736
@article{Yayla_Buschjager_Gupta_Chen_Henkel_Morik_Chen_Amrouch_2021, title={FeFET-Based Binarized Neural Networks Under Temperature-Dependent Bit Errors}, volume={71}, DOI={10.1109/tc.2021.3104736}, number={7}, journal={IEEE Transactions on Computers}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Yayla, Mikail and Buschjager, Sebastian and Gupta, Aniket and Chen, Jian-Jia and Henkel, Jorg and Morik, Katharina and Chen, Kuan-Hsun and Amrouch, Hussam}, year={2021}, pages={1681–1695} }
Yayla, Mikail, Sebastian Buschjager, Aniket Gupta, Jian-Jia Chen, Jorg Henkel, Katharina Morik, Kuan-Hsun Chen, and Hussam Amrouch. “FeFET-Based Binarized Neural Networks Under Temperature-Dependent Bit Errors.” IEEE Transactions on Computers 71, no. 7 (2021): 1681–95. https://doi.org/10.1109/tc.2021.3104736.
M. Yayla et al., “FeFET-Based Binarized Neural Networks Under Temperature-Dependent Bit Errors,” IEEE Transactions on Computers, vol. 71, no. 7, pp. 1681–1695, 2021, doi: 10.1109/tc.2021.3104736.
Yayla, Mikail, et al. “FeFET-Based Binarized Neural Networks Under Temperature-Dependent Bit Errors.” IEEE Transactions on Computers, vol. 71, no. 7, Institute of Electrical and Electronics Engineers (IEEE), 2021, pp. 1681–95, doi:10.1109/tc.2021.3104736.
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