Future Computing Platform Design: A Cross-Layer Design Approach
H.-Y. Cheng, C.-F. wu, C. Hakert, K.-H. Chen, Y.-H. Chang, J.-J. Chen, C.-L. Yang, T.-W. Kuo, in: 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, 2021.
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Cheng, Hsiang-Yun;
wu, Chun-Feng;
Hakert, Christian;
Chen, Kuan-Hsun;
Chang, Yuan-Hao;
Chen, Jian-Jia;
Yang, Chia-Lin;
Kuo, Tei-Wei
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2021 Design, Automation & Test in Europe Conference & Exhibition (DATE)
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Cheng H-Y, wu C-F, Hakert C, et al. Future Computing Platform Design: A Cross-Layer Design Approach. In: 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE; 2021. doi:10.23919/date51398.2021.9474229
Cheng, H.-Y., wu, C.-F., Hakert, C., Chen, K.-H., Chang, Y.-H., Chen, J.-J., Yang, C.-L., & Kuo, T.-W. (2021). Future Computing Platform Design: A Cross-Layer Design Approach. 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE). https://doi.org/10.23919/date51398.2021.9474229
@inproceedings{Cheng_wu_Hakert_Chen_Chang_Chen_Yang_Kuo_2021, title={Future Computing Platform Design: A Cross-Layer Design Approach}, DOI={10.23919/date51398.2021.9474229}, booktitle={2021 Design, Automation & Test in Europe Conference & Exhibition (DATE)}, publisher={IEEE}, author={Cheng, Hsiang-Yun and wu, Chun-Feng and Hakert, Christian and Chen, Kuan-Hsun and Chang, Yuan-Hao and Chen, Jian-Jia and Yang, Chia-Lin and Kuo, Tei-Wei}, year={2021} }
Cheng, Hsiang-Yun, Chun-Feng wu, Christian Hakert, Kuan-Hsun Chen, Yuan-Hao Chang, Jian-Jia Chen, Chia-Lin Yang, and Tei-Wei Kuo. “Future Computing Platform Design: A Cross-Layer Design Approach.” In 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE, 2021. https://doi.org/10.23919/date51398.2021.9474229.
H.-Y. Cheng et al., “Future Computing Platform Design: A Cross-Layer Design Approach,” 2021, doi: 10.23919/date51398.2021.9474229.
Cheng, Hsiang-Yun, et al. “Future Computing Platform Design: A Cross-Layer Design Approach.” 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, 2021, doi:10.23919/date51398.2021.9474229.
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