Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear

A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015.

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To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tool tip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard's wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.
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2015 17th Electronics Packaging Technology Conference
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Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: 2015 17th Electronics Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412375
Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., & Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412375
@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015, title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear}, DOI={10.1109/EPTC.2015.7412375}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger, Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon and Eacock, Florian and Brökelmann, Michael}, year={2015} }
Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In 2015 17th Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412375.
A. Unger et al., “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in 2015 17th Electronics Packaging Technology Conference, 2015.
Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412375.

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