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135 Publications
2023 | Conference Abstract | LibreCat-ID: 51119
C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
LibreCat
2022 | Book Chapter | LibreCat-ID: 33500
T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.
LibreCat
| DOI
| Download (ext.)
2022 | Conference Paper | LibreCat-ID: 30371
O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
LibreCat
2022 | Conference Paper | LibreCat-ID: 34104
C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.
LibreCat
| DOI
2022 | Report | LibreCat-ID: 52045
C. Scheidemann, T. Hemsel, and W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.
LibreCat
| Files available
| DOI
2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
LibreCat
| DOI
2020 | Conference Paper | LibreCat-ID: 17355
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 14852
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Atomization of Fluids with Ultrasound,” in Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), Enschede, The Netherlands, 2019, pp. 140–143.
LibreCat
| Files available
2019 | Conference Paper | LibreCat-ID: 15244
O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,” in 2. VDI-Fachtagung Schwingungen 2019, 2019.
LibreCat
2019 | Conference Paper | LibreCat-ID: 10258
P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, and W. Sextro, “Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten,” in DAGA 2019, Rostock, 2019.
LibreCat
2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
LibreCat
| DOI
2018 | Journal Article | LibreCat-ID: 9990
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders,” ACTUATOR 2018; 16th International Conference on New Actuators, pp. 142–145, 2018.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9992
C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
LibreCat
2017 | Journal Article | LibreCat-ID: 9972
P. Dunst, T. Hemsel, and W. Sextro, “Analysis of pipe vibration in an ultrasonic powder transportationsystem,” elsevier, vol. Sensors and Actuators A 263, pp. 733–736, 2017.
LibreCat
2017 | Conference Paper | LibreCat-ID: 9982
R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für Akustik, 2017, pp. 611–614.
LibreCat