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135 Publications
2023 | Conference Abstract | LibreCat-ID: 51119
Scheidemann, Claus, et al. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. 2023.
LibreCat
2022 | Book Chapter | LibreCat-ID: 33500
Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.” Reference Module in Materials Science and Materials Engineering, Elsevier, 2022, doi:10.1016/b978-0-12-819728-8.00047-4.
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2022 | Conference Paper | LibreCat-ID: 30371
Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, 2022, pp. 138–43.
LibreCat
2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022, doi:10.1109/estc55720.2022.9939478.
LibreCat
| DOI
2022 | Report | LibreCat-ID: 52045
Scheidemann, Claus, et al. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022, doi:10.2314/KXP:1879655276.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
LibreCat
| DOI
2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 14852
Dunst, Paul, et al. “Atomization of Fluids with Ultrasound.” Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), edited by Joost Lötters and Gerald Urban, 2019, pp. 140–43.
LibreCat
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2019 | Conference Paper | LibreCat-ID: 15244
Hagedorn, Oliver Ernst Caspar, et al. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
LibreCat
2019 | Conference Paper | LibreCat-ID: 10258
Dunst, Paul, et al. “Modellbasierte Und Experimentelle Charakterisierung von Intensiven Ultraschall-Stehwellenfeldern Für Die Zerstäubung Hochviskoser Flüssigkeiten.” DAGA 2019, 2019.
LibreCat
2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical, vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.
LibreCat
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2018 | Journal Article | LibreCat-ID: 9990
Dunst, Paul, et al. “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders.” ACTUATOR 2018; 16th International Conference on New Actuators, 2018, pp. 142–45.
LibreCat
2018 | Journal Article | LibreCat-ID: 9991
Dunst, Paul, et al. “Vibration-Assisted Handling of Dry Fine Powders.” Actuators 2018, 7(2)., 2018, pp. 1–11, doi:10.3390/act7020018.
LibreCat
| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
LibreCat
2017 | Journal Article | LibreCat-ID: 9972
Dunst, Paul, et al. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.” Elsevier, vol. Sensors and Actuators A 263, 2017, pp. 733–36.
LibreCat
2017 | Conference Paper | LibreCat-ID: 9978
Kimotho, James Kuria, et al. “Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing.” IEEE Transactions on Reliability, 2017, pp. 1–10, doi:10.1109/TR.2017.2710260.
LibreCat
| DOI
2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017, pp. 611–14.
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