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10 Publications


2016 | Journal Article | LibreCat-ID: 20942
Hoppe C, Ebbert C, Voigt M, et al. Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. ADVANCED ENGINEERING MATERIALS. 2016;18(6):1066-1074. doi:10.1002/adem.201500501
LibreCat | DOI | WoS
 

2014 | Journal Article | LibreCat-ID: 20944
Ebbert C, Schmidt HC, Rodman D, et al. Joining with electrochemical support (ECUF): Cold pressure welding of copper. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY. 2014;214(10):2179-2187. doi:10.1016/j.jmatprotec.2014.04.015
LibreCat | DOI | WoS
 

2014 | Journal Article | LibreCat-ID: 20924
Ebbert C, Alissawi N, Somsen C, et al. Spectroelectrochemical and morphological studies of the ageing of silver nanoparticles embedded in ultra-thin perfluorinated sputter deposited films. Thin Solid Films. 2014:161-167. doi:10.1016/j.tsf.2014.10.054
LibreCat | DOI
 

2013 | Journal Article | LibreCat-ID: 20946
Alissawi N, Peter T, Strunskus T, Ebbert C, Grundmeier G, Faupel F. Plasma-polymerized HMDSO coatings to adjust the silver ion release properties of Ag/polymer nanocomposites. JOURNAL OF NANOPARTICLE RESEARCH. 2013;15(11). doi:10.1007/s11051-013-2080-9
LibreCat | DOI | WoS
 

2011 | Journal Article | LibreCat-ID: 20947
Maxisch M, Ebbert C, Torun B, et al. PM-IRRAS studies of the adsorption and stability of organophosphonate monolayers on passivated NiTi surfaces. APPLIED SURFACE SCIENCE. 2011;257(6):2011-2018. doi:10.1016/j.apsusc.2010.09.044
LibreCat | DOI | WoS
 

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