Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).

We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.

13 Publications


2016 | Conference Paper | LibreCat-ID: 9968
A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
LibreCat
 

2015 | Conference Paper | LibreCat-ID: 9943
S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process in copper wire bonding by adapting bonding parameters,” in 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.
LibreCat | DOI
 

2015 | Conference Paper | LibreCat-ID: 9951
T. Meyer et al., “Modeling and simulation of the ultrasonic wire bonding process,” in 2015 17th Electronics Packaging Technology Conference, 2015.
LibreCat | DOI
 

2015 | Conference Paper | LibreCat-ID: 9954
A. Unger et al., “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in 2015 17th Electronics Packaging Technology Conference, 2015.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9871
P. Eichwald et al., “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
LibreCat
 

2014 | Conference Paper | LibreCat-ID: 9896
A. Unger et al., “Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding,” in Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, vol. 141, pp. 175–180.
LibreCat
 

2013 | Conference Paper | LibreCat-ID: 9799
P. Eichwald et al., “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding,” in 15th Electronics Packaging Technology Conference, 2013.
LibreCat | DOI
 

Filters and Search Terms

(project=92)

Search

Filter Publications

Display / Sort

Citation Style: IEEE

Export / Embed