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13 Publications
2018 | Conference Paper | LibreCat-ID: 9999
Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9955
Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234
LibreCat
| DOI
2016 | Journal Article | LibreCat-ID: 9957
Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen. wt-online. 2016;7/8:512-519.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9960
Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9966
Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9968
Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.
LibreCat
2015 | Conference Paper | LibreCat-ID: 9943
Althoff S, Unger A, Sextro W, Eacock F. Improving the cleaning process in copper wire bonding by adapting bonding parameters. In: 2015 17th Electronics Packaging Technology Conference. ; 2015:1-6. doi:10.1109/EPTC.2015.7412402
LibreCat
| DOI
2015 | Conference Paper | LibreCat-ID: 9951
Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic wire bonding process. In: 2015 17th Electronics Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412377
LibreCat
| DOI
2015 | Conference Paper | LibreCat-ID: 9954
Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: 2015 17th Electronics Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412375
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9871
Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014:856-861. doi:10.4071/isom-THP34
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger A, Sextro W, Althoff S, et al. Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding. In: Proceedings of 8th International Conference on Integrated Power Electronic Systems. Vol 141. ; 2014:175-180.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9799
Eichwald P, Sextro W, Althoff S, et al. Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding. In: 15th Electronics Packaging Technology Conference. ; 2013. doi:10.1109/EPTC.2013.6745803
LibreCat
| DOI