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13 Publications
2018 | Conference Paper | LibreCat-ID: 9999
@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }
LibreCat
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2016 | Conference Paper | LibreCat-ID: 9955
@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }
LibreCat
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2016 | Journal Article | LibreCat-ID: 9957
@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016, title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online}, author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten}, year={2016}, pages={512–519} }
LibreCat
2016 | Conference Paper | LibreCat-ID: 9960
@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016, title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael}, year={2016} }
LibreCat
2016 | Conference Paper | LibreCat-ID: 9966
@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={10.1109/ECTC.2016.215}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }
LibreCat
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2016 | Conference Paper | LibreCat-ID: 9968
@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }
LibreCat
2015 | Conference Paper | LibreCat-ID: 9943
@inproceedings{Althoff_Unger_Sextro_Eacock_2015, title={Improving the cleaning process in copper wire bonding by adapting bonding parameters}, DOI={10.1109/EPTC.2015.7412402}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Althoff, Simon and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2015}, pages={1–6} }
LibreCat
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2015 | Conference Paper | LibreCat-ID: 9951
@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015, title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={10.1109/EPTC.2015.7412377}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }
LibreCat
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2015 | Conference Paper | LibreCat-ID: 9954
@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015, title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear}, DOI={10.1109/EPTC.2015.7412375}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger, Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon and Eacock, Florian and Brökelmann, Michael}, year={2015} }
LibreCat
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2014 | Conference Paper | LibreCat-ID: 9871
@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }
LibreCat
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2014 | Conference Paper | LibreCat-ID: 9895
@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
@inproceedings{Unger_Sextro_Althoff_Meyer_Brökelmann_Neumann_Reimann_Guth_Bolowski_2014, title={Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding}, volume={141}, booktitle={Proceedings of 8th International Conference on Integrated Power Electronic Systems}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Meyer, Tobias and Brökelmann, Michael and Neumann, Klaus and Reimann, René Felix and Guth, Karsten and Bolowski, Daniel}, year={2014}, pages={175–180} }
LibreCat
2013 | Conference Paper | LibreCat-ID: 9799
@inproceedings{Eichwald_Sextro_Althoff_Eacock_Schnietz_Guth_Brökelmann_2013, title={Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding}, DOI={10.1109/EPTC.2013.6745803}, booktitle={15th Electronics Packaging Technology Conference}, author={Eichwald, Paul and Sextro, Walter and Althoff, Simon and Eacock, Florian and Schnietz, Mark and Guth, Karsten and Brökelmann, Michael}, year={2013} }
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