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13 Publications
2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016. https://doi.org/10.1109/ECTC.2016.234.
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2016 | Journal Article | LibreCat-ID: 9957
Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen Intelligent Herstellen.” Wt-Online 7/8 (2016): 512–19.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9960
Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54. IEEE CPMT Symposium Japan, 2016.
LibreCat
2015 | Conference Paper | LibreCat-ID: 9943
Althoff, Simon, Andreas Unger, Walter Sextro, and Florian Eacock. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” In 2015 17th Electronics Packaging Technology Conference, 1–6, 2015. https://doi.org/10.1109/EPTC.2015.7412402.
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2015 | Conference Paper | LibreCat-ID: 9951
Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” In 2015 17th Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412377.
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2015 | Conference Paper | LibreCat-ID: 9954
Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In 2015 17th Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412375.
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2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger, Andreas, Walter Sextro, Simon Althoff, Tobias Meyer, Michael Brökelmann, Klaus Neumann, René Felix Reimann, Karsten Guth, and Daniel Bolowski. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” In Proceedings of 8th International Conference on Integrated Power Electronic Systems, 141:175–80, 2014.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9799
Eichwald, Paul, Walter Sextro, Simon Althoff, Florian Eacock, Mark Schnietz, Karsten Guth, and Michael Brökelmann. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” In 15th Electronics Packaging Technology Conference, 2013. https://doi.org/10.1109/EPTC.2013.6745803.
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