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13 Publications


2018 | Conference Paper | LibreCat-ID: 9999
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
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2016 | Conference Paper | LibreCat-ID: 9955
S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
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2016 | Journal Article | LibreCat-ID: 9957
M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,” wt-online, vol. 7/8, pp. 512–519, 2016.
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2016 | Conference Paper | LibreCat-ID: 9960
P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,” in IEEE CPMT Symposium Japan, 2016, 2016.
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2016 | Conference Paper | LibreCat-ID: 9966
T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
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2016 | Conference Paper | LibreCat-ID: 9968
A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
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2015 | Conference Paper | LibreCat-ID: 9943
S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process in copper wire bonding by adapting bonding parameters,” in 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.
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2015 | Conference Paper | LibreCat-ID: 9951
T. Meyer et al., “Modeling and simulation of the ultrasonic wire bonding process,” in 2015 17th Electronics Packaging Technology Conference, 2015.
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2015 | Conference Paper | LibreCat-ID: 9954
A. Unger et al., “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in 2015 17th Electronics Packaging Technology Conference, 2015.
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2014 | Conference Paper | LibreCat-ID: 9871
P. Eichwald et al., “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
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2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2014 | Conference Paper | LibreCat-ID: 9896
A. Unger et al., “Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding,” in Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, vol. 141, pp. 175–180.
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2013 | Conference Paper | LibreCat-ID: 9799
P. Eichwald et al., “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding,” in 15th Electronics Packaging Technology Conference, 2013.
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