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13 Publications
2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
LibreCat
| DOI
2016 | Journal Article | LibreCat-ID: 9957
Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” Wt-Online, vol. 7/8, 2016, pp. 512–19.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9960
Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.” IEEE CPMT Symposium Japan, 2016, 2016.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54.
LibreCat
2015 | Conference Paper | LibreCat-ID: 9943
Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6, doi:10.1109/EPTC.2015.7412402.
LibreCat
| DOI
2015 | Conference Paper | LibreCat-ID: 9951
Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412377.
LibreCat
| DOI
2015 | Conference Paper | LibreCat-ID: 9954
Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412375.
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger, Andreas, et al. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” Proceedings of 8th International Conference on Integrated Power Electronic Systems, vol. 141, 2014, pp. 175–80.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9799
Eichwald, Paul, et al. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” 15th Electronics Packaging Technology Conference, 2013, doi:10.1109/EPTC.2013.6745803.
LibreCat
| DOI