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302 Publications
2023 | Journal Article | LibreCat-ID: 44672 | 
Model-based condition monitoring of piezoelectric bending actuators
A. Bender, Sensors and Actuators A: Physical 357 (2023).
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A. Bender, Sensors and Actuators A: Physical 357 (2023).
2023 | Dissertation | LibreCat-ID: 41970
Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse
P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse, Shaker, 2023.
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P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse, Shaker, 2023.
2023 | Dissertation | LibreCat-ID: 41971
Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
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S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
2022 | Report | LibreCat-ID: 52045
Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
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C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
2022 | Patent | LibreCat-ID: 9980
Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung der Bauteil-Restnutzungsdauer.
K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2022).
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K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2022).
2022 | Conference Paper | LibreCat-ID: 34104
Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
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C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
2022 | Newspaper Article | LibreCat-ID: 47159
On the applicability of time series features as health indicators for technical systems operating under varying conditions
O.K. Aimiyekagbon, A. Bender, W. Sextro, Condition Monitor (2022) 5–10.
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O.K. Aimiyekagbon, A. Bender, W. Sextro, Condition Monitor (2022) 5–10.
2022 | Conference Paper | LibreCat-ID: 30371
Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
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O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
2022 | Book Chapter | LibreCat-ID: 29727
Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction
M.C. Wohlleben, A. Bender, S. Peitz, W. Sextro, in: Machine Learning, Optimization, and Data Science, Springer International Publishing, Cham, 2022.
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M.C. Wohlleben, A. Bender, S. Peitz, W. Sextro, in: Machine Learning, Optimization, and Data Science, Springer International Publishing, Cham, 2022.
2022 | Dissertation | LibreCat-ID: 34272 |
Enhanced process development by simulation of ultrasonic heavy wire bonding
R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.
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R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.