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77 Publications
2021 | Journal Article | LibreCat-ID: 21436
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat
| DOI
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
2020 | Conference Paper | LibreCat-ID: 30211
A Process to Develop Lean Big-Data Platform Architectures for Industrial Manufacturing Contexts
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
LibreCat
| DOI
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
2020 | Book Chapter | LibreCat-ID: 44471
Re/Dis-Solved Selves: (Re)Searching Selfies, (Inter)Facing the Face
J. Eckel, in: S. Althoff, E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re-/Dissolving Mimesis, Fink, Berlin, 2020, pp. 261–290.
LibreCat
J. Eckel, in: S. Althoff, E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re-/Dissolving Mimesis, Fink, Berlin, 2020, pp. 261–290.
2020 | Conference Paper | LibreCat-ID: 17355
Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
2020 | Conference Paper | LibreCat-ID: 17706
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.
LibreCat
| DOI
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.
2020 | Book (Editor) | LibreCat-ID: 47618
Re/Dissolving Mimesis
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, eds., Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
LibreCat
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, eds., Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
2020 | Book Chapter | LibreCat-ID: 47623
A CCTV Image that Dissolves like Smeared Data: Distinguishability versus Similarity
S. Althoff, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
LibreCat
| DOI
S. Althoff, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
2020 | Book Chapter | LibreCat-ID: 47622
Editorial: Re/Dissolving Mimesis
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
LibreCat
| DOI
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
2020 | Journal Article | LibreCat-ID: 47624
Seeping Out: The diminishment of the subject in Hito Steyerl’s How Not to Be Seen
S. Althoff, Performance Research 24 (2020) 92–98.
LibreCat
| DOI
S. Althoff, Performance Research 24 (2020) 92–98.
2020 | Conference Paper | LibreCat-ID: 30860
A Process to Develop Lean Big-Data Platform Architectures for Industrial Manufacturing Contexts
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
LibreCat
| DOI
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
2019 | Conference Paper | LibreCat-ID: 15244
Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen
O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
LibreCat
O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
2019 | Conference Paper | LibreCat-ID: 15412
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
LibreCat
| Files available
| DOI
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
2019 | Journal Article | LibreCat-ID: 10334
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat
| DOI
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
2018 | Conference Paper | LibreCat-ID: 9992
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
2018 | Conference Paper | LibreCat-ID: 9993
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
2018 | Conference Paper | LibreCat-ID: 9997
Effects of different working frequencies on the joint formation in copper wire bonding
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.
LibreCat
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.
2018 | Conference Paper | LibreCat-ID: 9998
Numerical and experimental investigations in ultrasonic heavy wire bonding
R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.
LibreCat
R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.
2018 | Journal Article | LibreCat-ID: 47625
Inhabiting the Profile: Zach Blas’s Facial Weaponizaton Suite
S. Althoff, Intermédialités. Histoire et Théorie Des Art, Des Lettres et Des Techniques 32 (2018).
LibreCat
| DOI
S. Althoff, Intermédialités. Histoire et Théorie Des Art, Des Lettres et Des Techniques 32 (2018).
2017 | Journal Article | LibreCat-ID: 9973
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
LibreCat
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
2017 | Dissertation | LibreCat-ID: 9986 | 
Modellbasierte Mehrzieloptimierung zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen
A. Unger, Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen, Universität Paderborn, 2017.
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| Download (ext.)
A. Unger, Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen, Universität Paderborn, 2017.