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77 Publications


2016 | Conference Paper | LibreCat-ID: 9955
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
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2016 | Journal Article | LibreCat-ID: 9957
Kupferbondverbindungen intelligent herstellen
M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
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2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
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2016 | Conference Paper | LibreCat-ID: 9960
Micro Wear Modeling in Copper Wire Wedge Bonding
P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.
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2016 | Conference Paper | LibreCat-ID: 9966
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
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2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
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2016 | Book Chapter | LibreCat-ID: 29778
Positive Beispiele zu negativen Zahlen – Unterrichtsstudien zum Mathematikunterricht. Abschlussbericht
P.G. Althoff, R. Friedli, M. Hattermann, R. Vom Hofe, H. Kullmann, F. Viehmeister, in: N. Freke, H. Kullmann, F. Lücker, B. Lütje-Klose, S. Schwab, A. Textor, C.T. Zenke (Eds.), Laborschulforschung 2016. Berichte Und Anträge Zum Forschungs- Und Entwicklungsplan. Werkstattheft Nr. 52, {Wissenschaftliche Einrichtung Laborschule an der Universität Bielefeld}, Bielefeld, 2016, pp. 11–87.
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2016 | Conference Paper | LibreCat-ID: 38259
Accelerated Testing of Polarization-Tracking Receiver Using Polarization Scrambler with Peaked Speed Distribution
B. Koch, R. Noé, V. Mirvoda, D. Sandel, in: Photonic Networks; 17. ITG-Symposium; Proceedings Of, 2016, pp. 1–3.
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2015 | Conference Paper | LibreCat-ID: 9943
Improving the cleaning process in copper wire bonding by adapting bonding parameters
S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.
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2015 | Conference Paper | LibreCat-ID: 9951
Modeling and simulation of the ultrasonic wire bonding process
T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.
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2015 | Conference Paper | LibreCat-ID: 9954
Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear
A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015.
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2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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2014 | Conference Paper | LibreCat-ID: 9870
Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
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2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
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2014 | Conference Paper | LibreCat-ID: 9896
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F. Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, pp. 175–180.
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2013 | Journal Article | LibreCat-ID: 4600 LibreCat | DOI
 

2013 | Conference Paper | LibreCat-ID: 9797
A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
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2013 | Conference Paper | LibreCat-ID: 9799
Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding
P. Eichwald, W. Sextro, S. Althoff, F. Eacock, M. Schnietz, K. Guth, M. Brökelmann, in: 15th Electronics Packaging Technology Conference, 2013.
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2013 | Book Chapter | LibreCat-ID: 29776
Positive Beispiele zu negativen Zahlen – Unterrichtsstudien zum~Mathematikunterricht. Verlängerungsantrag zum Forschungs- und Entwicklungsplan 2013–2015
P.G. Althoff, R. Friedli, M. Hattermann, R. Vom Hofe, H. Kullmann, J. Lukas, F. Viehmeister, in: N. Freke, B. Koch, H. Kullmann, A. Textor, V. Young, C.T. Zenke (Eds.), Laborschulforschung 2013. Anträge Und Berichte Zum Forschungs- Und Entwicklungsplan. Werkstattheft Nr. 48, {Wissenschaftliche Einrichtung Laborschule an der Universität Bielefeld}, Bielefeld, 2013, pp. 93–126.
LibreCat
 

2013 | Book Chapter | LibreCat-ID: 29775
Positive Beispiele zu negativen Zahlen – Unterrichtsstudien zum~Mathematikunterricht. Verlängerungsantrag zum Forschungs- und Entwicklungsplan 2013–2015
P.G. Althoff, R. Friedli, M. Hattermann, R. Vom Hofe, H. Kullmann, J. Lukas, F. Viehmeister, in: N. Freke, B. Koch, H. Kullmann, A. Textor, V. Young, C.T. Zenke (Eds.), Laborschulforschung 2013. Anträge Und Berichte Zum Forschungs- Und Entwicklungsplan. Werkstattheft Nr. 48, {Wissenschaftliche Einrichtung Laborschule an der Universität Bielefeld}, Bielefeld, 2013, pp. 93–126.
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