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17 Publications
2016 | Conference Paper | LibreCat-ID: 9959
Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In IEEE 66th Electronic Components and Technology Conference (pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9966
Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., & Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9868
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555). https://doi.org/10.1109/ECTC.2014.6897500
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9870
Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In Proceedings of the 47th International Symposium on Microelectronics. https://doi.org/10.4071/isom-THP32
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., & Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the 47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., & Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
LibreCat
2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis, S., Berth, G., Wiedemeier, V., Schmidt, L., Zrenner, A., & Warnecke, H.-J. (2010). Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence, 130(10), 1958–1962. https://doi.org/10.1016/j.jlumin.2010.05.012
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| DOI