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17 Publications


2016 | Conference Paper | LibreCat-ID: 9959
F. Eacock et al., “Effect of different oxide layers on the ultrasonic copper wire bond process,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
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2016 | Conference Paper | LibreCat-ID: 9966
T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
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2014 | Conference Paper | LibreCat-ID: 9868
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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2014 | Conference Paper | LibreCat-ID: 9870
F. Eacock et al., “Microstructural investigations of aluminum and copper wire bonds,” in Proceedings of the 47th International Symposium on Microelectronics, 2014.
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2014 | Conference Paper | LibreCat-ID: 9871
P. Eichwald et al., “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
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2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2010 | Journal Article | LibreCat-ID: 4548
S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, and H.-J. Warnecke, “Oxygen sensing by fluorescence quenching of [Cu(btmgp)I],” Journal of Luminescence, vol. 130, no. 10, pp. 1958–1962, 2010.
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