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20 Publications
2017 | Conference Paper | LibreCat-ID: 9982
MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
LibreCat
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
2017 | Journal Article | LibreCat-ID: 13238
Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition
A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational Chemistry 38 (2017) 2276–2282.
LibreCat
| DOI
A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational Chemistry 38 (2017) 2276–2282.
2016 | Conference Paper | LibreCat-ID: 9955
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
LibreCat
| DOI
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
LibreCat
| DOI
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
LibreCat
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
2014 | Conference Paper | LibreCat-ID: 9870
Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
LibreCat
| DOI
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
2014 | Conference Paper | LibreCat-ID: 9871
Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
LibreCat
| DOI
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
2013 | Conference Paper | LibreCat-ID: 9797
A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.