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20 Publications


2017 | Conference Paper | LibreCat-ID: 9982
R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für Akustik, 2017, pp. 611–614.
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2017 | Journal Article | LibreCat-ID: 13238
A. Lücke, U. Gerstmann, T. D. Kühne, and W. G. Schmidt, “Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition,” Journal of Computational Chemistry, vol. 38, no. 26, pp. 2276–2282, 2017.
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2016 | Conference Paper | LibreCat-ID: 9955
S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
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2016 | Conference Paper | LibreCat-ID: 9959
F. Eacock et al., “Effect of different oxide layers on the ultrasonic copper wire bond process,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
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2016 | Conference Paper | LibreCat-ID: 9968
A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
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2014 | Conference Paper | LibreCat-ID: 9868
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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2014 | Conference Paper | LibreCat-ID: 9870
F. Eacock et al., “Microstructural investigations of aluminum and copper wire bonds,” in Proceedings of the 47th International Symposium on Microelectronics, 2014.
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2014 | Conference Paper | LibreCat-ID: 9871
P. Eichwald et al., “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
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2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2013 | Conference Paper | LibreCat-ID: 9797
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach for modeling wire bonding,” in IMAPS 2013, 46th International Symposium on Microelectronics, 2013.
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