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29 Publications


2018 | Conference Paper | LibreCat-ID: 9993
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9999
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
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2018 | Journal Article | LibreCat-ID: 30935
Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT
J. Anderski, L. Mahlert, J. Sun, W. Birnbaum, D. Mulac, S. Schreiber, F. Herrmann, D. Kuckling, K. Langer, International Journal of Pharmaceutics 557 (2018) 182–191.
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2017 | Conference Paper | LibreCat-ID: 9982
MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
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2017 | Journal Article | LibreCat-ID: 13238
Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition
A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational Chemistry 38 (2017) 2276–2282.
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2016 | Conference Paper | LibreCat-ID: 9955
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
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2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
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2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
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2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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2014 | Conference Paper | LibreCat-ID: 9870
Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
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2014 | Conference Paper | LibreCat-ID: 9871
Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
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2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
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2014 | Conference Paper | LibreCat-ID: 17202
Studying the Co-Construction of Interaction Protocols in Collaborative Tasks with Humans
A.-L. Vollmer, J. Grizou, M. Lopes, K. Rohlfing, P.-Y. Oudeyer, in: 2014 Joint IEEE International Conference on Development and Learning and on Epigenetic Robotics, IEEE, 2014, pp. 208–215.
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2013 | Conference Paper | LibreCat-ID: 9797
A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.
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2012 | Journal Article | LibreCat-ID: 5717
Culture’s Impact on Customer Motivation to Engage in Professional Service Enactments.
J.H. Schumann, N. Wünderlich, M.S. Zimmer, Schmalenbach Business Review 64 (2012) 141–165.
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2005 | Journal Article | LibreCat-ID: 2412
System-level performance evaluation of reconfigurable processors
R. Enzler, C. Plessl, M. Platzner, Microprocessors and Microsystems 29 (2005) 63–73.
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2005 | Conference Paper | LibreCat-ID: 39030
A UML Virtual Machine for Embedded Systems
T. Schattkowsky, W. Müller, in: Proceedings of ISNG 05, Las Vegas, NV, 2005.
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2003 | Conference Paper | LibreCat-ID: 2422
Co-simulation of a Hybrid Multi-Context Architecture
R. Enzler, C. Plessl, M. Platzner, in: Proc. Int. Conf. on Engineering of Reconfigurable Systems and Algorithms (ERSA), CSREA Press, 2003, pp. 174–180.
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2000 | Mastersthesis | LibreCat-ID: 2433
Hardware/Software Codesign in Speech Compression Applications
C. Plessl, S. Maurer, Hardware/Software Codesign in Speech Compression Applications, Computer Engineering and Networks Lab, ETH Zurich, Switzerland, 2000.
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