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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
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2021 | Journal Article | LibreCat-ID: 21436
@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }
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| DOI
2018 | Conference Paper | LibreCat-ID: 9999
@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }
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| DOI
2018 | Journal Article | LibreCat-ID: 13186
@article{Rösener_Hoffmann_Herres-Pawlis_2018, title={Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility}, volume={2018}, DOI={10.1002/ejic.201800511}, number={27}, journal={European Journal of Inorganic Chemistry}, author={Rösener, Thomas and Hoffmann, Alexander and Herres-Pawlis, Sonja}, year={2018}, pages={3164–3175} }
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2017 | Journal Article | LibreCat-ID: 13187
@article{Oppermann_Laurini_Etscheidt_Hollmann_Strassl_Hoffmann_Schurr_Dittmeyer_Rinke_Herres-Pawlis_2017, title={Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer}, volume={40}, DOI={10.1002/ceat.201600691}, number={8}, journal={Chemical Engineering \& Technology}, author={Oppermann, Alexander and Laurini, Larissa and Etscheidt, Fabian and Hollmann, Katharina and Strassl, Florian and Hoffmann, Alexander and Schurr, Daniela and Dittmeyer, Roland and Rinke, Günter and Herres-Pawlis, Sonja}, year={2017}, pages={1475–1483} }
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2016 | Conference Paper | LibreCat-ID: 9959
@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={10.1109/ECTC.2016.91}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9966
@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={10.1109/ECTC.2016.215}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }
LibreCat
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2014 | Conference Paper | LibreCat-ID: 9868
@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }
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2014 | Conference Paper | LibreCat-ID: 9870
@inproceedings{Eacock _Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title={Microstructural investigations of aluminum and copper wire bonds}, DOI={10.4071/isom-THP32}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig, Martin Joachim and Guth, Karsten}, year={2014} }
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9871
@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }
LibreCat
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2014 | Conference Paper | LibreCat-ID: 9895
@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }
LibreCat
2010 | Journal Article | LibreCat-ID: 4548
@article{Herres-Pawlis_Berth_Wiedemeier_Schmidt_Zrenner_Warnecke_2010, title={Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]}, volume={130}, DOI={10.1016/j.jlumin.2010.05.012}, number={10}, journal={Journal of Luminescence}, publisher={Elsevier BV}, author={Herres-Pawlis, Sonja and Berth, Gerhard and Wiedemeier, Volker and Schmidt, Ludger and Zrenner, Artur and Warnecke, Hans-Joachim}, year={2010}, pages={1958–1962} }
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