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12 Publications


2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
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2018 | Journal Article | LibreCat-ID: 13186
Rösener, Thomas, et al. “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility.” European Journal of Inorganic Chemistry, vol. 2018, no. 27, 2018, pp. 3164–75, doi:10.1002/ejic.201800511.
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2017 | Journal Article | LibreCat-ID: 13187
Oppermann, Alexander, et al. “Detection of Copper Bisguanidine NO Adducts by UV-Vis Spectroscopy and a SuperFocus Mixer.” Chemical Engineering \& Technology, vol. 40, no. 8, 2017, pp. 1475–83, doi:10.1002/ceat.201600691.
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” Proceedings of the 47th International Symposium on Microelectronics, 2014, doi:10.4071/isom-THP32.
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2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
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2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis, Sonja, et al. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].” Journal of Luminescence, vol. 130, no. 10, Elsevier BV, 2010, pp. 1958–62, doi:10.1016/j.jlumin.2010.05.012.
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