Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).

We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.

1 Publication


2017 | Journal Article | LibreCat-ID: 9973
Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., & Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. IMAPSource, Vol. 2017, No. 1.
LibreCat
 

Filters and Search Terms

keyword="International Symposium on Microelectronics"

Search

Filter Publications

Display / Sort

Citation Style: APA

Export / Embed