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1 Publication
2017 | Journal Article | LibreCat-ID: 9973
Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., & Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. IMAPSource, Vol. 2017, No. 1.
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