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1 Publication
2017 | Journal Article | LibreCat-ID: 9973
@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}, volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2017} }
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