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2 Publications
2025 | Conference Paper | LibreCat-ID: 62641
Kruse S, Diri J, Mager T, Kress C, Scheytt JC. Electrooptical Integration of an Electronic Photonic Integrated Circuit Into Plastic Substrates Using Mid-Technology. In: 2025 55th European Microwave Conference (EuMC). ; 2025:127-130. doi:10.23919/EuMC65286.2025.11235121
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| DOI
2014 | Conference Paper | LibreCat-ID: 9868
Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500
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| DOI