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2 Publications


2025 | Conference Paper | LibreCat-ID: 62641
S. Kruse, J. Diri, T. Mager, C. Kress, and J. C. Scheytt, “Electrooptical Integration of an Electronic Photonic Integrated Circuit Into Plastic Substrates Using Mid-Technology,” in 2025 55th European Microwave Conference (EuMC), 2025, pp. 127–130, doi: 10.23919/EuMC65286.2025.11235121.
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2014 | Conference Paper | LibreCat-ID: 9868
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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