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2 Publications
2025 | Conference Paper | LibreCat-ID: 62641
Kruse, S., Diri, J., Mager, T., Kress, C., & Scheytt, J. C. (2025). Electrooptical Integration of an Electronic Photonic Integrated Circuit Into Plastic Substrates Using Mid-Technology. 2025 55th European Microwave Conference (EuMC), 127–130. https://doi.org/10.23919/EuMC65286.2025.11235121
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| DOI
2014 | Conference Paper | LibreCat-ID: 9868
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555). https://doi.org/10.1109/ECTC.2014.6897500
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| DOI