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5 Publications


2025 | Journal Article | LibreCat-ID: 58807
Neuser, M., Holtkamp, P. K., Hoyer, K.-P., Kappe, F., Yildiz, S., Bobbert, M., Meschut, G., & Schaper, M. (2025). Mechanical properties and joinability of the near-eutectic aluminium casting alloy AlSi12. The Journal of Materials: Design and Applications, Part L. 5th International Conference on Materials Design and Applications 2024, Porto, Portugal. https://doi.org/10.1177/14644207251319922
LibreCat | DOI
 

2024 | Conference Paper | LibreCat-ID: 49437
Pfeffer, N., Kaiser, M. A., Meyer, T., Göken, M., & Höppel, H. W. (n.d.). The new TISTRAQ process: Solution treatment with rapid quenching and annealing for Ti-6Al-4V sheet metal part forming - the effect of processing parameters on microstructure and mechanical properties. IOM3. Chapter 14: Forming, Machining & Joining [Version 1; Not Peer Reviewed]. 15th World Conference on Titanium, Edinburgh. https://doi.org/10.7490/f1000research.1119929.1
LibreCat | DOI
 

2022 | Journal Article | LibreCat-ID: 29196 | OA
Hein, M., Kokalj, D., Lopes Dias, N. F., Stangier, D., Oltmanns, H., Pramanik, S., Kietzmann, M., Hoyer, K.-P., Meißner, J., Tillmann, W., & Schaper, M. (2022). Low Cycle Fatigue Performance of Additively Processed and Heat-Treated Ti-6Al-7Nb Alloy for Biomedical Applications. Metals, 12(1), Article 122. https://doi.org/10.3390/met12010122
LibreCat | Files available | DOI | Download (ext.)
 

2018 | Journal Article | LibreCat-ID: 34438
Thielen, S., Magyar, B., Sauer, B., Schneider, F., Mayer, P., Kirsch, B., Müller, R., v. Harbou, E., & Aurich, J. C. (2018). Functional investigation of zero lead radial shaft seal counter-surfaces turned with a special method. Tribology International, 118, 442–450. https://doi.org/10.1016/j.triboint.2017.02.002
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In Proceedings of the 47th International Symposium on Microelectronics. https://doi.org/10.4071/isom-THP32
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