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16 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.
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2023 | Journal Article | LibreCat-ID: 43045
Knyazyev, Mykhaylo, et al. “Investigation of Pressure Fields Generated by Two Simultaneous Discharges in Liquid Initiated by Wires.” Journal of Manufacturing and Materials Processing, vol. 7, no. 1, 40, MDPI AG, 2023, doi:10.3390/jmmp7010040.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–94.
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2021 | Conference Paper | LibreCat-ID: 29849
Strothmann, Benjamin, et al. “Common-Mode-Free Bidirectional Three-Phase PFC-Rectifier for Non-Isolated EV Charger.” 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), IEEE, 2021, doi:10.1109/apec42165.2021.9487462.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017, pp. 611–14.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
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| DOI
2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
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| DOI
2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
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2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” IMAPS 2013, 46th International Symposium on Microelectronics, 2013, doi:10.4071/isom-2013-TA67.
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