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138 Publications
2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
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2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.
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2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679
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2019 | Conference Paper | LibreCat-ID: 14852
Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., & Sextro, W. (2019). Atomization of Fluids with Ultrasound. In J. Lötters & G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019) (pp. 140–143). Enschede, The Netherlands.
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2019 | Conference Paper | LibreCat-ID: 15244
Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., & Sextro, W. (2019). Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019.
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2019 | Conference Paper | LibreCat-ID: 10258
Dunst, P., Hemsel, T., Bornmann, P., Littmann, W., & Sextro, W. (2019). Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten. In DAGA 2019. Rostock.
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2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. International Symposium on Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662. https://doi.org/10.1016/j.sna.2019.04.025
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2018 | Journal Article | LibreCat-ID: 9990
Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., & Sextro, W. (2018). Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International Conference on New Actuators, 142–145.
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2018 | Journal Article | LibreCat-ID: 9991
Dunst, P., Bornmann, P., Hemsel, T., & Sextro, W. (2018). Vibration-Assisted Handling of Dry Fine Powders. Actuators 2018, 7(2)., 1–11. https://doi.org/10.3390/act7020018
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
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2018 | Conference Paper | LibreCat-ID: 9998
Schemmel, R., Hemsel, T., & Sextro, W. (2018). Numerical and experimental investigations in ultrasonic heavy wire bonding. In 6th European Conference on Computational Mechanics (ECCM 6) (pp. 1–12). Glasgow, UK.
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2017 | Journal Article | LibreCat-ID: 9972
Dunst, P., Hemsel, T., & Sextro, W. (2017). Analysis of pipe vibration in an ultrasonic powder transportationsystem. Elsevier, Sensors and Actuators A 263, 733–736.
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2017 | Conference Paper | LibreCat-ID: 9978
Kimotho, J. K., Sextro, W., & Hemsel, T. (2017). Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing. In IEEE Transactions on Reliability (pp. 1–10). https://doi.org/10.1109/TR.2017.2710260
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2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für Akustik (pp. 611–614). Kiel 2017.
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2016 | Conference Paper | LibreCat-ID: 9958
Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., & Littmann, W. (2016). Transportation of dry fine powders by coordinated friction manipulation. In PAMM Proc. Appl. Math. Mech. 16 (pp. 635–636). Braunschweig. https://doi.org/10.1002/pamm.201610306
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2015 | Journal Article | LibreCat-ID: 9944
Bornmann, P., Hemsel, T., Sextro, W., Memoli, G., Hodnett, M., & Zeqiri, B. (2015). Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. Tm - Technisches Messen, 82(2), 73–84. https://doi.org/10.1515/teme-2015-0017
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2015 | Journal Article | LibreCat-ID: 9948
Kudo, R., Bornmann, P., Hemsel, T., & Morita, T. (2015). Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method. Acoustical Science and Technology, 36(3), 262–264. https://doi.org/10.1250/ast.36.262
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555). https://doi.org/10.1109/ECTC.2014.6897500
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