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138 Publications
2024 | Journal Article | LibreCat-ID: 51518
O. K. Aimiyekagbon, A. Bender, T. Hemsel, and W. Sextro, “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions,” Electronics, vol. 13, no. 3, Art. no. 521, 2024, doi: 10.3390/electronics13030521.
LibreCat
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2023 | Conference Abstract | LibreCat-ID: 47234
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023.
LibreCat
| Files available
2023 | Conference Abstract | LibreCat-ID: 47235
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023.
LibreCat
| Files available
2023 | Conference Abstract | LibreCat-ID: 51117
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51118
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51119
C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
LibreCat
2022 | Book Chapter | LibreCat-ID: 33500
T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.
LibreCat
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2022 | Conference Paper | LibreCat-ID: 30371
O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
LibreCat
2022 | Conference Paper | LibreCat-ID: 34104
C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.
LibreCat
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2022 | Report | LibreCat-ID: 52045
C. Scheidemann, T. Hemsel, and W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.
LibreCat
| Files available
| DOI
2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Conference Paper | LibreCat-ID: 17355
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.
LibreCat
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2019 | Conference Paper | LibreCat-ID: 14852
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Atomization of Fluids with Ultrasound,” in Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), Enschede, The Netherlands, 2019, pp. 140–143.
LibreCat
| Files available
2019 | Conference Paper | LibreCat-ID: 15244
O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,” in 2. VDI-Fachtagung Schwingungen 2019, 2019.
LibreCat
2019 | Conference Paper | LibreCat-ID: 10258
P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, and W. Sextro, “Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten,” in DAGA 2019, Rostock, 2019.
LibreCat
2019 | Conference Paper | LibreCat-ID: 15412
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.
LibreCat
| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
LibreCat
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2018 | Journal Article | LibreCat-ID: 9990
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders,” ACTUATOR 2018; 16th International Conference on New Actuators, pp. 142–145, 2018.
LibreCat