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142 Publications


2025 | Journal Article | LibreCat-ID: 58510 | OA
C. Scheidemann, P. Bornmann, W. Littmann, and T. Hemsel, “Lead-Free Ceramics in Prestressed Ultrasonic Transducers,” Actuators, vol. 14, no. 2, Art. no. 55, 2025, doi: 10.3390/act14020055.
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2024 | Journal Article | LibreCat-ID: 51518
O. K. Aimiyekagbon, A. Bender, T. Hemsel, and W. Sextro, “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions,” Electronics, vol. 13, no. 3, Art. no. 521, 2024, doi: 10.3390/electronics13030521.
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2024 | Conference Paper | LibreCat-ID: 56834 | OA
O. Friesen, L. Claes, C. Scheidemann, N. Feldmann, T. Hemsel, and B. Henning, “Estimation of temperature-dependent piezoelectric material parameters using ring-shaped specimens,” in 2023 International Congress on Ultrasonics, Beijing, China, 2024, vol. 2822, p. 012125, doi: 10.1088/1742-6596/2822/1/012125.
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2024 | Journal Article | LibreCat-ID: 57467
D. Lehnert et al., “The Influence of Ultrasonic Irradiation of a 316L Weld Pool Produced by DED on the Mechanical Properties of the Produced Component,” Crystals, vol. 14, no. 11, Art. no. 1001, 2024, doi: 10.3390/cryst14111001.
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2024 | Journal Article | LibreCat-ID: 57332
D. Lehnert et al., “The Influence of Ultrasonic Irradiation of a 316L Weld Pool Produced by DED on the Mechanical Properties of the Produced Component,” Crystals, vol. 14, no. 11, Art. no. 1001, 2024, doi: 10.3390/cryst14111001.
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2023 | Conference Abstract | LibreCat-ID: 51117
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023.
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2023 | Conference Abstract | LibreCat-ID: 51118
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.
LibreCat
 

2023 | Conference Abstract | LibreCat-ID: 51119
C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
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2023 | Conference Abstract | LibreCat-ID: 47234
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023.
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2023 | Conference Abstract | LibreCat-ID: 47235
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023.
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2022 | Book Chapter | LibreCat-ID: 33500
T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.
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2022 | Report | LibreCat-ID: 52045
C. Scheidemann, T. Hemsel, and W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.
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2022 | Conference Paper | LibreCat-ID: 30371
O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
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2022 | Conference Paper | LibreCat-ID: 34104
C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.
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2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Conference Paper | LibreCat-ID: 17355
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
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2020 | Conference Paper | LibreCat-ID: 17706
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.
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2019 | Conference Paper | LibreCat-ID: 14852
P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Atomization of Fluids with Ultrasound,” in Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), Enschede, The Netherlands, 2019, pp. 140–143.
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2019 | Conference Paper | LibreCat-ID: 15244
O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,” in 2. VDI-Fachtagung Schwingungen 2019, 2019.
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2019 | Conference Paper | LibreCat-ID: 10258
P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, and W. Sextro, “Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten,” in DAGA 2019, Rostock, 2019.
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