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142 Publications
2025 | Journal Article | LibreCat-ID: 58510 | 
Scheidemann C, Bornmann P, Littmann W, Hemsel T. Lead-Free Ceramics in Prestressed Ultrasonic Transducers. Actuators. 2025;14(2). doi:10.3390/act14020055
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2024 | Journal Article | LibreCat-ID: 51518
Aimiyekagbon OK, Bender A, Hemsel T, Sextro W. Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics. 2024;13(3). doi:10.3390/electronics13030521
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2024 | Conference Paper | LibreCat-ID: 56834 |
Friesen O, Claes L, Scheidemann C, Feldmann N, Hemsel T, Henning B. Estimation of temperature-dependent piezoelectric material parameters using ring-shaped specimens. In: 2023 International Congress on Ultrasonics, Beijing, China. Vol 2822. IOP Publishing; 2024:012125. doi:10.1088/1742-6596/2822/1/012125
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2024 | Journal Article | LibreCat-ID: 57467
Lehnert D, Bödger C, Pabel P, et al. The Influence of Ultrasonic Irradiation of a 316L Weld Pool Produced by DED on the Mechanical Properties of the Produced Component. Crystals. 2024;14(11). doi:10.3390/cryst14111001
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2024 | Journal Article | LibreCat-ID: 57332
Lehnert D, Bödger C, Pabel P, et al. The Influence of Ultrasonic Irradiation of a 316L Weld Pool Produced by DED on the Mechanical Properties of the Produced Component. Crystals. 2024;14(11). doi:10.3390/cryst14111001
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2023 | Conference Abstract | LibreCat-ID: 51117
Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51118
Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51119
Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 47234
Sehlmeyer B, Kampmann R, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM). ; 2023.
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2023 | Conference Abstract | LibreCat-ID: 47235
Kampmann R, Sehlmeyer B, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM). ; 2023.
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2022 | Book Chapter | LibreCat-ID: 33500
Hemsel T, Twiefel J. Piezoelectric Ultrasonic Power Transducers. In: Reference Module in Materials Science and Materials Engineering. Elsevier; 2022. doi:10.1016/b978-0-12-819728-8.00047-4
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2022 | Report | LibreCat-ID: 52045
Scheidemann C, Hemsel T, Sextro W. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University; 2022. doi:10.2314/KXP:1879655276
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2022 | Conference Paper | LibreCat-ID: 30371
Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.
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2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
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2020 | Conference Paper | LibreCat-ID: 17355
Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems. ; 2020:1-6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679
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2019 | Conference Paper | LibreCat-ID: 14852
Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Atomization of Fluids with Ultrasound. In: Lötters J, Urban G, eds. Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019). Enschede, The Netherlands; 2019:140-143.
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2019 | Conference Paper | LibreCat-ID: 15244
Hagedorn OEC, Pielsticker D, Hemsel T, Sextro W. Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In: 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019; 2019.
LibreCat
2019 | Conference Paper | LibreCat-ID: 10258
Dunst P, Hemsel T, Bornmann P, Littmann W, Sextro W. Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten. In: DAGA 2019. ; 2019.
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