13 Publications
2022 | Dissertation | LibreCat-ID: 34272 | 
R. Schemmel, Enhanced process development by simulation of ultrasonic heavy wire bonding, vol. 13. Shaker, 2022.
LibreCat
| Files available
| DOI
| Download (ext.)
2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
LibreCat
| DOI
2020 | Conference Paper | LibreCat-ID: 17355
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15412
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.
LibreCat
| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
LibreCat
| DOI
2018 | Conference Paper | LibreCat-ID: 9992
C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–235.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
LibreCat
2017 | Conference Paper | LibreCat-ID: 9982
R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für Akustik, 2017, pp. 611–614.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9968
A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
LibreCat
13 Publications
2022 | Dissertation | LibreCat-ID: 34272 |
R. Schemmel, Enhanced process development by simulation of ultrasonic heavy wire bonding, vol. 13. Shaker, 2022.
LibreCat
| Files available
| DOI
| Download (ext.)
2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
LibreCat
| DOI
2020 | Conference Paper | LibreCat-ID: 17355
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15412
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.
LibreCat
| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
LibreCat
| DOI
2018 | Conference Paper | LibreCat-ID: 9992
C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–235.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
LibreCat
2017 | Conference Paper | LibreCat-ID: 9982
R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für Akustik, 2017, pp. 611–614.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9968
A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
LibreCat