13 Publications
2022 | Dissertation | LibreCat-ID: 34272 | 
@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Enhanced process development by simulation of ultrasonic heavy wire bonding}, volume={13}, DOI={10.17619/UNIPB/1-1280}, publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
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2021 | Journal Article | LibreCat-ID: 21436
@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }
LibreCat
| DOI
2020 | Conference Paper | LibreCat-ID: 17355
@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS 2020; 11th International Conference on Integrated Power Electronics Systems}, author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf and Sextro, Walter}, year={2020}, pages={1–6} }
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={10.1109/eurosime48426.2020.9152679}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15412
@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title={Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509}, booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }
LibreCat
| Files available
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2019 | Journal Article | LibreCat-ID: 10334
@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={10.1016/j.sna.2019.04.025}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }
LibreCat
| DOI
2018 | Conference Paper | LibreCat-ID: 9992
@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart, Germany}, title={Effects of different working frequencies on the joint formation in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={230–235} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}, volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2017} }
LibreCat
2017 | Conference Paper | LibreCat-ID: 9982
@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }
LibreCat
2016 | Conference Paper | LibreCat-ID: 9968
@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }
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13 Publications
2022 | Dissertation | LibreCat-ID: 34272 |
@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Enhanced process development by simulation of ultrasonic heavy wire bonding}, volume={13}, DOI={10.17619/UNIPB/1-1280}, publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
LibreCat
| Files available
| DOI
| Download (ext.)
2021 | Journal Article | LibreCat-ID: 21436
@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }
LibreCat
| DOI
2020 | Conference Paper | LibreCat-ID: 17355
@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS 2020; 11th International Conference on Integrated Power Electronics Systems}, author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf and Sextro, Walter}, year={2020}, pages={1–6} }
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={10.1109/eurosime48426.2020.9152679}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15412
@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title={Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509}, booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }
LibreCat
| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={10.1016/j.sna.2019.04.025}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }
LibreCat
| DOI
2018 | Conference Paper | LibreCat-ID: 9992
@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart, Germany}, title={Effects of different working frequencies on the joint formation in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={230–235} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}, volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2017} }
LibreCat
2017 | Conference Paper | LibreCat-ID: 9982
@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }
LibreCat
2016 | Conference Paper | LibreCat-ID: 9968
@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }
LibreCat