FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects

S. Hellebrand, T. Indlekofer, M. Kampmann, M. A. Kochte, C. Liu, H.-J. Wunderlich, in: IEEE International Test Conference (ITC’14), IEEE, Seattle, Washington, USA, 2014.

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Hellebrand, SybilleLibreCat ; Indlekofer, Thomas; Kampmann, MatthiasLibreCat; A. Kochte, Michael; Liu, Chang; Wunderlich, Hans-Joachim
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IEEE International Test Conference (ITC'14)
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Hellebrand S, Indlekofer T, Kampmann M, A. Kochte M, Liu C, Wunderlich H-J. FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects. In: IEEE International Test Conference (ITC’14). Seattle, Washington, USA: IEEE; 2014. doi:10.1109/test.2014.7035360
Hellebrand, S., Indlekofer, T., Kampmann, M., A. Kochte, M., Liu, C., & Wunderlich, H.-J. (2014). FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects. In IEEE International Test Conference (ITC’14). Seattle, Washington, USA: IEEE. https://doi.org/10.1109/test.2014.7035360
@inproceedings{Hellebrand_Indlekofer_Kampmann_A. Kochte_Liu_Wunderlich_2014, place={Seattle, Washington, USA}, title={FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects}, DOI={10.1109/test.2014.7035360}, booktitle={IEEE International Test Conference (ITC’14)}, publisher={IEEE}, author={Hellebrand, Sybille and Indlekofer, Thomas and Kampmann, Matthias and A. Kochte, Michael and Liu, Chang and Wunderlich, Hans-Joachim}, year={2014} }
Hellebrand, Sybille, Thomas Indlekofer, Matthias Kampmann, Michael A. Kochte, Chang Liu, and Hans-Joachim Wunderlich. “FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects.” In IEEE International Test Conference (ITC’14). Seattle, Washington, USA: IEEE, 2014. https://doi.org/10.1109/test.2014.7035360.
S. Hellebrand, T. Indlekofer, M. Kampmann, M. A. Kochte, C. Liu, and H.-J. Wunderlich, “FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects,” in IEEE International Test Conference (ITC’14), 2014.
Hellebrand, Sybille, et al. “FAST-BIST: Faster-than-at-Speed BIST Targeting Hidden Delay Defects.” IEEE International Test Conference (ITC’14), IEEE, 2014, doi:10.1109/test.2014.7035360.

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