Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren
R. Wang, Y. Sun, M. Kaynak, J.C. Scheytt, (2012).
Download
No fulltext has been uploaded.
Patent
Inventor
Wang, Ruoyu;
Sun, Yaoming;
Kaynak, Mehmet;
Scheytt, J. ChristophLibreCat 
Abstract
Chipantenne (102), umfassend mindestens einen Strahler (114,116), der sich parallel zu einer Hauptoberfläche eines die Chipantenne tragenden Halbleitersubstrats (104) erstreckt, wobei der Strahler auf einer inselartigen Trägerzone (122,124) des Halbleitersubstrats angeordnet ist, die von mindestens einem vollständig mit einem Gas gefüllten Graben (126,128) umgeben ist, welcher das Halbleitersubstrat in dessen gesamter Tiefenerstreckung durchdringt und durch mindestens einen Haltesteg (130,132,134,136) überbrückt ist, welcher eine tragende Verbindung zwischen der Trägerzone und dem übrigen Halbleitersubstrat bildet.
The invention relates to a chip antenna (102) comprising at least one emitter (114, 116) which extends parallel to a main surface of a semiconductor substrate (104) supporting the chip antenna. The emitter is arranged on an island-like support zone (122, 124) of the semiconductor substrate, said support zone being surrounded by at least one trench (126, 128) which is completely filled with a gas. The trench passes through the entire depth of the semiconductor substrate and is bridged by at least one retaining web (130, 132, 134, 136) which forms a supporting connection between the support zone and the rest of the semiconductor substrate.
The invention relates to a chip antenna (102) comprising at least one emitter (114, 116) which extends parallel to a main surface of a semiconductor substrate (104) supporting the chip antenna. The emitter is arranged on an island-like support zone (122, 124) of the semiconductor substrate, said support zone being surrounded by at least one trench (126, 128) which is completely filled with a gas. The trench passes through the entire depth of the semiconductor substrate and is bridged by at least one retaining web (130, 132, 134, 136) which forms a supporting connection between the support zone and the rest of the semiconductor substrate.
Publishing Year
Int. Patent Number
WO/2014/102260
Int. Patent Classification
PCT/EP2013/077951
LibreCat-ID
Cite this
Wang R, Sun Y, Kaynak M, Scheytt JC. Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren. Published online 2012.
Wang, R., Sun, Y., Kaynak, M., & Scheytt, J. C. (2012). Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren.
@article{Wang_Sun_Kaynak_Scheytt_2012, title={Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren}, author={Wang, Ruoyu and Sun, Yaoming and Kaynak, Mehmet and Scheytt, J. Christoph}, year={2012} }
Wang, Ruoyu, Yaoming Sun, Mehmet Kaynak, and J. Christoph Scheytt. “Chip-Antenne, Elektronisches Bauelement Und Herstellungsverfahren,” 2012.
R. Wang, Y. Sun, M. Kaynak, and J. C. Scheytt, “Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren.” 2012.
Wang, Ruoyu, et al. Chip-Antenne, Elektronisches Bauelement Und Herstellungsverfahren. 2012.
External material:
Confirmation Letter
Google Scholar