Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications
F. Hemmelgarn, P. Ehlert, T. Mager, C. Jürgenhake, R. Dumitrescu, in: 14th International Congress Molded Interconnect Devices (MID), 2021.
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Conference Paper
| Published
| English
Author
Hemmelgarn, Florian;
Ehlert, Patrick;
Mager, Thomas;
Jürgenhake, Christoph;
Dumitrescu, RomanLibreCat
Publishing Year
Proceedings Title
14th International Congress Molded Interconnect Devices (MID)
Conference
International Congress Molded Interconnect Devices (MID)
Conference Location
Amberg
Conference Date
2021-02-9 – 2021-02-10
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Hemmelgarn F, Ehlert P, Mager T, Jürgenhake C, Dumitrescu R. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. In: 14th International Congress Molded Interconnect Devices (MID). ; 2021.
Hemmelgarn, F., Ehlert, P., Mager, T., Jürgenhake, C., & Dumitrescu, R. (2021). Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). International Congress Molded Interconnect Devices (MID), Amberg.
@inproceedings{Hemmelgarn_Ehlert_Mager_Jürgenhake_Dumitrescu_2021, title={Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications}, booktitle={14th International Congress Molded Interconnect Devices (MID)}, author={Hemmelgarn, Florian and Ehlert, Patrick and Mager, Thomas and Jürgenhake, Christoph and Dumitrescu, Roman}, year={2021} }
Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jürgenhake, and Roman Dumitrescu. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” In 14th International Congress Molded Interconnect Devices (MID), 2021.
F. Hemmelgarn, P. Ehlert, T. Mager, C. Jürgenhake, and R. Dumitrescu, “Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications,” presented at the International Congress Molded Interconnect Devices (MID), Amberg, 2021.
Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” 14th International Congress Molded Interconnect Devices (MID), 2021.
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