Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology
A.R. Javed, J.C. Scheytt, in: 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS), IEEE, Lansing, MI, USA, 2021.
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Javed, Abdul Rehman;
Scheytt, J. ChristophLibreCat
Abstract
The circuit design and measurement results of a mixed-signal receiver baseband circuit for a wireless high data rate communication system are presented. The circuit design of the two most important system blocks of the sliced receiver baseband architecture, namely the broadband, programmable code-generator circuit, and the integrate and dump correlator circuit are explained. Using parallel sequence spread spectrum (PSSS) with PAM-4 modulated data, a net data rate of 2.22 Gbps is demonstrated with a single receiver baseband slice circuit working with a chip rate of 20 Gcps. A total of 15 slices are required to recover all 15 parallelly transmitted symbols resulting in the net data rate of 33.33 Gbps. This is the first reported implementation of a mixed-signal PSSS baseband circuit.
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2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
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Javed AR, Scheytt JC. Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology. In: 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS). IEEE; 2021. doi:10.1109/MWSCAS47672.2021.9531711
Javed, A. R., & Scheytt, J. C. (2021). Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology. 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS). https://doi.org/10.1109/MWSCAS47672.2021.9531711
@inproceedings{Javed_Scheytt_2021, place={ Lansing, MI, USA}, title={Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology}, DOI={10.1109/MWSCAS47672.2021.9531711}, booktitle={2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)}, publisher={IEEE}, author={Javed, Abdul Rehman and Scheytt, J. Christoph}, year={2021} }
Javed, Abdul Rehman, and J. Christoph Scheytt. “Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 Nm SiGe BiCMOS Technology.” In 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS). Lansing, MI, USA: IEEE, 2021. https://doi.org/10.1109/MWSCAS47672.2021.9531711.
A. R. Javed and J. C. Scheytt, “Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology,” 2021, doi: 10.1109/MWSCAS47672.2021.9531711.
Javed, Abdul Rehman, and J. Christoph Scheytt. “Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 Nm SiGe BiCMOS Technology.” 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS), IEEE, 2021, doi:10.1109/MWSCAS47672.2021.9531711.
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