Atomic Layer Deposition of Copper Metal Films from Cu(acac) 2 and Hydroquinone Reductant
T.S. Tripathi, M. Wilken, C. Hoppe, T. de los Arcos, G. Grundmeier, A. Devi, M. Karppinen, Advanced Engineering Materials 23 (2021).
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Journal Article
| Published
| English
Author
Tripathi, Tripurari Sharan;
Wilken, Martin;
Hoppe, ChristianLibreCat;
de los Arcos, Teresa;
Grundmeier, GuidoLibreCat;
Devi, Anjana;
Karppinen, Maarit
Department
Publishing Year
Journal Title
Advanced Engineering Materials
Volume
23
Issue
10
Article Number
2100446
LibreCat-ID
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Tripathi TS, Wilken M, Hoppe C, et al. Atomic Layer Deposition of Copper Metal Films from Cu(acac) 2 and Hydroquinone Reductant. Advanced Engineering Materials. 2021;23(10). doi:10.1002/adem.202100446
Tripathi, T. S., Wilken, M., Hoppe, C., de los Arcos, T., Grundmeier, G., Devi, A., & Karppinen, M. (2021). Atomic Layer Deposition of Copper Metal Films from Cu(acac) 2 and Hydroquinone Reductant. Advanced Engineering Materials, 23(10), Article 2100446. https://doi.org/10.1002/adem.202100446
@article{Tripathi_Wilken_Hoppe_de los Arcos_Grundmeier_Devi_Karppinen_2021, title={Atomic Layer Deposition of Copper Metal Films from Cu(acac) 2 and Hydroquinone Reductant}, volume={23}, DOI={10.1002/adem.202100446}, number={102100446}, journal={Advanced Engineering Materials}, publisher={Wiley}, author={Tripathi, Tripurari Sharan and Wilken, Martin and Hoppe, Christian and de los Arcos, Teresa and Grundmeier, Guido and Devi, Anjana and Karppinen, Maarit}, year={2021} }
Tripathi, Tripurari Sharan, Martin Wilken, Christian Hoppe, Teresa de los Arcos, Guido Grundmeier, Anjana Devi, and Maarit Karppinen. “Atomic Layer Deposition of Copper Metal Films from Cu(Acac) 2 and Hydroquinone Reductant.” Advanced Engineering Materials 23, no. 10 (2021). https://doi.org/10.1002/adem.202100446.
T. S. Tripathi et al., “Atomic Layer Deposition of Copper Metal Films from Cu(acac) 2 and Hydroquinone Reductant,” Advanced Engineering Materials, vol. 23, no. 10, Art. no. 2100446, 2021, doi: 10.1002/adem.202100446.
Tripathi, Tripurari Sharan, et al. “Atomic Layer Deposition of Copper Metal Films from Cu(Acac) 2 and Hydroquinone Reductant.” Advanced Engineering Materials, vol. 23, no. 10, 2100446, Wiley, 2021, doi:10.1002/adem.202100446.
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