Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology
U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to Machine Communications 1 (2015) 197–214.
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Journal Article
| Published
| English
Author
Hilleringmann, UlrichLibreCat;
Assion, F.;
Vidor, F. F.;
Wirth, G. I.
Department
Keywords
Publishing Year
Journal Title
Journal of Machine to Machine Communications
Volume
1
Issue
3
Page
197-214
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Hilleringmann U, Assion F, Vidor FF, Wirth GI. Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology. Journal of Machine to Machine Communications. 2015;1(3):197-214. doi:10.13052/jmmc2246-137x.131
Hilleringmann, U., Assion, F., Vidor, F. F., & Wirth, G. I. (2015). Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology. Journal of Machine to Machine Communications, 1(3), 197–214. https://doi.org/10.13052/jmmc2246-137x.131
@article{Hilleringmann_Assion_Vidor_Wirth_2015, title={Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology}, volume={1}, DOI={10.13052/jmmc2246-137x.131}, number={3}, journal={Journal of Machine to Machine Communications}, publisher={River Publishers}, author={Hilleringmann, Ulrich and Assion, F. and Vidor, F. F. and Wirth, G. I.}, year={2015}, pages={197–214} }
Hilleringmann, Ulrich, F. Assion, F. F. Vidor, and G. I. Wirth. “Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology.” Journal of Machine to Machine Communications 1, no. 3 (2015): 197–214. https://doi.org/10.13052/jmmc2246-137x.131.
U. Hilleringmann, F. Assion, F. F. Vidor, and G. I. Wirth, “Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology,” Journal of Machine to Machine Communications, vol. 1, no. 3, pp. 197–214, 2015, doi: 10.13052/jmmc2246-137x.131.
Hilleringmann, Ulrich, et al. “Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology.” Journal of Machine to Machine Communications, vol. 1, no. 3, River Publishers, 2015, pp. 197–214, doi:10.13052/jmmc2246-137x.131.
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