Method development (modelling, simulation, characterisation) in adhesive bonding technology
F. Beule, M. Al Trjman, D. Teutenberg, G. Meschut, in: Shanghai, 2024.
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Conference Abstract
| English
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Department
Publishing Year
Conference
International Symposium Smart Joining Solutions for Future Mobility
Conference Location
Shanghai
Conference Date
2024-04-24 – 2024-04-24
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Beule F, Al Trjman M, Teutenberg D, Meschut G. Method development (modelling, simulation, characterisation) in adhesive bonding technology. In: ; 2024.
Beule, F., Al Trjman, M., Teutenberg, D., & Meschut, G. (2024). Method development (modelling, simulation, characterisation) in adhesive bonding technology. International Symposium Smart Joining Solutions for Future Mobility, Shanghai.
@inproceedings{Beule_Al Trjman_Teutenberg_Meschut_2024, place={Shanghai}, title={Method development (modelling, simulation, characterisation) in adhesive bonding technology}, author={Beule, Felix and Al Trjman, Mohamad and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }
Beule, Felix, Mohamad Al Trjman, Dominik Teutenberg, and Gerson Meschut. “Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology.” Shanghai, 2024.
F. Beule, M. Al Trjman, D. Teutenberg, and G. Meschut, “Method development (modelling, simulation, characterisation) in adhesive bonding technology,” presented at the International Symposium Smart Joining Solutions for Future Mobility, Shanghai, 2024.
Beule, Felix, et al. Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology. 2024.
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