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13 Publications
2018 | Conference Paper | LibreCat-ID: 9999
Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.). https://doi.org/10.4071/2380-4505-2018.1.000572
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
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2016 | Journal Article | LibreCat-ID: 9957
Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M., … Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. Wt-Online, 7/8, 512–519.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9960
Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., & Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE CPMT Symposium Japan, 2016.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9966
Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., & Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 (pp. 251–254). IEEE CPMT Symposium Japan.
LibreCat
2015 | Conference Paper | LibreCat-ID: 9943
Althoff, S., Unger, A., Sextro, W., & Eacock, F. (2015). Improving the cleaning process in copper wire bonding by adapting bonding parameters. In 2015 17th Electronics Packaging Technology Conference (pp. 1–6). https://doi.org/10.1109/EPTC.2015.7412402
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2015 | Conference Paper | LibreCat-ID: 9951
Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., & Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding process. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412377
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2015 | Conference Paper | LibreCat-ID: 9954
Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., & Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412375
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2014 | Conference Paper | LibreCat-ID: 9871
Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., & Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the 47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., & Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger, A., Sextro, W., Althoff, S., Meyer, T., Brökelmann, M., Neumann, K., … Bolowski, D. (2014). Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding. In Proceedings of 8th International Conference on Integrated Power Electronic Systems (Vol. 141, pp. 175–180).
LibreCat
2013 | Conference Paper | LibreCat-ID: 9799
Eichwald, P., Sextro, W., Althoff, S., Eacock, F., Schnietz, M., Guth, K., & Brökelmann, M. (2013). Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding. In 15th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2013.6745803
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