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13 Publications
2022 | Dissertation | LibreCat-ID: 34272 | 
Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic heavy wire bonding (Vol. 13). Shaker. https://doi.org/10.17619/UNIPB/1-1280
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
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2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.
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2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679
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2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. International Symposium on Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662. https://doi.org/10.1016/j.sna.2019.04.025
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
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2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., & Hunstig, M. (2018). Effects of different working frequencies on the joint formation in copper wire bonding. In CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018) (pp. 230–235). Stuttgart, Germany.
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2018 | Conference Paper | LibreCat-ID: 9998
Schemmel, R., Hemsel, T., & Sextro, W. (2018). Numerical and experimental investigations in ultrasonic heavy wire bonding. In 6th European Conference on Computational Mechanics (ECCM 6) (pp. 1–12). Glasgow, UK.
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