Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).
We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.
13 Publications
2022 | Dissertation | LibreCat-ID: 34272 |
Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic heavy wire bonding (Vol. 13). Shaker. https://doi.org/10.17619/UNIPB/1-1280
LibreCat
| Files available
| DOI
| Download (ext.)
2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
LibreCat
| DOI
2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679
LibreCat
| DOI
2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. International Symposium on Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
LibreCat
| Files available
| DOI
2019 | Journal Article | LibreCat-ID: 10334
Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662. https://doi.org/10.1016/j.sna.2019.04.025
LibreCat
| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., & Hunstig, M. (2018). Effects of different working frequencies on the joint formation in copper wire bonding. In CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018) (pp. 230–235). Stuttgart, Germany.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9998
Schemmel, R., Hemsel, T., & Sextro, W. (2018). Numerical and experimental investigations in ultrasonic heavy wire bonding. In 6th European Conference on Computational Mechanics (ECCM 6) (pp. 1–12). Glasgow, UK.
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., & Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. IMAPSource, Vol. 2017, No. 1.
LibreCat
2017 | Conference Paper | LibreCat-ID: 9982
Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für Akustik (pp. 611–614). Kiel 2017.
LibreCat
2016 | Conference Paper | LibreCat-ID: 9968
Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 (pp. 251–254). IEEE CPMT Symposium Japan.
LibreCat