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77 Publications
2024 | Book Chapter | LibreCat-ID: 47619
Walking with Images: Mimetic-Automatic Production in Hasan Elahi’s Tracking Transcience
S. Althoff, in: G. Gasparavicius, M. Toteva, T. Williams (Eds.), Walking with the Enemy: Reclaiming the Language of Power and Manipulation in the Post-Truth Era, Manchester University Press, Manchester, n.d.
LibreCat
S. Althoff, in: G. Gasparavicius, M. Toteva, T. Williams (Eds.), Walking with the Enemy: Reclaiming the Language of Power and Manipulation in the Post-Truth Era, Manchester University Press, Manchester, n.d.
2024 | Journal Article | LibreCat-ID: 52693
The Condemnation of Hate and the Violence of the Status Quo
S. Althoff, Cultural Politics 20 (2024) 45–59.
LibreCat
| DOI
S. Althoff, Cultural Politics 20 (2024) 45–59.
2023 | Dissertation | LibreCat-ID: 41971
Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
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S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
2023 | Conference Abstract | LibreCat-ID: 47234
Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.
LibreCat
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B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.
2023 | Conference Abstract | LibreCat-ID: 47235
Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.
LibreCat
| Files available
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.
2023 | Book | LibreCat-ID: 47617
Digitale Desökonomie: Unproduktivität, Trägheit und Exzess im digitalen Milieu
S. Althoff, Digitale Desökonomie: Unproduktivität, Trägheit und Exzess im digitalen Milieu, transcript, Bielefeld, 2023.
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S. Althoff, Digitale Desökonomie: Unproduktivität, Trägheit und Exzess im digitalen Milieu, transcript, Bielefeld, 2023.
2023 | Conference Abstract | LibreCat-ID: 51117
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
2023 | Conference Abstract | LibreCat-ID: 51118
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
2023 | Conference Abstract | LibreCat-ID: 51119
Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.
LibreCat
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.
2023 | Journal Article | LibreCat-ID: 52692
Was heißt Überleben? Die Zweischneidigkeit eines ubiquitären Begriffs
S. Althoff, Berliner Debatte Initial 34 (2023) 87–97.
LibreCat
S. Althoff, Berliner Debatte Initial 34 (2023) 87–97.
2022 | Dissertation | LibreCat-ID: 34272 | 
Enhanced process development by simulation of ultrasonic heavy wire bonding
R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.
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R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022.
2022 | Journal Article | LibreCat-ID: 34817
Regularity of Lie groups
M. Hanusch, Communications in Analysis and Geometry 30 (2022) 53–152.
LibreCat
| DOI
M. Hanusch, Communications in Analysis and Geometry 30 (2022) 53–152.
2022 | Journal Article | LibreCat-ID: 39362
Citizen Social Science in Germany—cooperation beyond invited and uninvited participation
C. Göbel, S. Mauermeister, J. Henke, Humanities and Social Sciences Communications 9 (2022).
LibreCat
| DOI
C. Göbel, S. Mauermeister, J. Henke, Humanities and Social Sciences Communications 9 (2022).
2022 | Conference Paper | LibreCat-ID: 30371
Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
LibreCat
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
2022 | Conference Paper | LibreCat-ID: 34104
Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
LibreCat
| DOI
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
2022 | Book Chapter | LibreCat-ID: 47621
Zweierlei Homophilie: Wendy Hui Kyong Chun und Leo Bersani
S. Althoff, in: F. Balke, E. Linseisen (Eds.), Mimesis Expanded: Die Ausweitung der mimetischen Zone, Wilhelm Fink, Paderborn, 2022, pp. 343–362.
LibreCat
| DOI
S. Althoff, in: F. Balke, E. Linseisen (Eds.), Mimesis Expanded: Die Ausweitung der mimetischen Zone, Wilhelm Fink, Paderborn, 2022, pp. 343–362.
2022 | Report | LibreCat-ID: 52045
Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
LibreCat
| Files available
| DOI
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
2022 | Journal Article | LibreCat-ID: 53321
Arbitrarily fast grow-up rates in quasilinear Keller–Segel systems
M. Winkler, Communications in Contemporary Mathematics 25 (2022).
LibreCat
| DOI
M. Winkler, Communications in Contemporary Mathematics 25 (2022).
2021 | Dissertation | LibreCat-ID: 34274
Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens
P. Eichwald, Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens, Shaker, 2021.
LibreCat
| Files available
P. Eichwald, Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens, Shaker, 2021.
2021 | Conference Paper | LibreCat-ID: 25265
Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes
D. Dreiling, D. Itner, N. Feldmann, C. Scheidemann, H. Gravenkamp, B. Henning, in: Fortschritte Der Akustik - DAGA 2021, Deutsche Gesellschaft für Akustik e.V. (DEGA), Wien, 2021.
LibreCat
| Files available
D. Dreiling, D. Itner, N. Feldmann, C. Scheidemann, H. Gravenkamp, B. Henning, in: Fortschritte Der Akustik - DAGA 2021, Deutsche Gesellschaft für Akustik e.V. (DEGA), Wien, 2021.
2021 | Journal Article | LibreCat-ID: 21436
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat
| DOI
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
2020 | Conference Paper | LibreCat-ID: 30211
A Process to Develop Lean Big-Data Platform Architectures for Industrial Manufacturing Contexts
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
LibreCat
| DOI
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
2020 | Book Chapter | LibreCat-ID: 44471
Re/Dis-Solved Selves: (Re)Searching Selfies, (Inter)Facing the Face
J. Eckel, in: S. Althoff, E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re-/Dissolving Mimesis, Fink, Berlin, 2020, pp. 261–290.
LibreCat
J. Eckel, in: S. Althoff, E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re-/Dissolving Mimesis, Fink, Berlin, 2020, pp. 261–290.
2020 | Conference Paper | LibreCat-ID: 17355
Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
LibreCat
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
2020 | Conference Paper | LibreCat-ID: 17706
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.
LibreCat
| DOI
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.
2020 | Book (Editor) | LibreCat-ID: 47618
Re/Dissolving Mimesis
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, eds., Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
LibreCat
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, eds., Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
2020 | Book Chapter | LibreCat-ID: 47623
A CCTV Image that Dissolves like Smeared Data: Distinguishability versus Similarity
S. Althoff, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
LibreCat
| DOI
S. Althoff, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
2020 | Book Chapter | LibreCat-ID: 47622
Editorial: Re/Dissolving Mimesis
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
LibreCat
| DOI
S. Althoff, E. Linseisen, M.-L. Müller, F. Winter, in: E. Linseisen, M.-L. Müller, F. Winter (Eds.), Re/Dissolving Mimesis, Wilhelm Fink, Paderborn, 2020.
2020 | Journal Article | LibreCat-ID: 47624
Seeping Out: The diminishment of the subject in Hito Steyerl’s How Not to Be Seen
S. Althoff, Performance Research 24 (2020) 92–98.
LibreCat
| DOI
S. Althoff, Performance Research 24 (2020) 92–98.
2020 | Conference Paper | LibreCat-ID: 30860
A Process to Develop Lean Big-Data Platform Architectures for Industrial Manufacturing Contexts
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
LibreCat
| DOI
M. Illian, S. Althoff, H. Karl, in: 2020 25th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), IEEE, 2020.
2019 | Conference Paper | LibreCat-ID: 15244
Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen
O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
LibreCat
O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
2019 | Conference Paper | LibreCat-ID: 15412
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
LibreCat
| Files available
| DOI
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
2019 | Journal Article | LibreCat-ID: 10334
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat
| DOI
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
2018 | Conference Paper | LibreCat-ID: 9992
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
2018 | Conference Paper | LibreCat-ID: 9993
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
2018 | Conference Paper | LibreCat-ID: 9997
Effects of different working frequencies on the joint formation in copper wire bonding
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.
LibreCat
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.
2018 | Conference Paper | LibreCat-ID: 9998
Numerical and experimental investigations in ultrasonic heavy wire bonding
R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.
LibreCat
R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.
2018 | Journal Article | LibreCat-ID: 47625
Inhabiting the Profile: Zach Blas’s Facial Weaponizaton Suite
S. Althoff, Intermédialités. Histoire et Théorie Des Art, Des Lettres et Des Techniques 32 (2018).
LibreCat
| DOI
S. Althoff, Intermédialités. Histoire et Théorie Des Art, Des Lettres et Des Techniques 32 (2018).
2017 | Journal Article | LibreCat-ID: 9973
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
LibreCat
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
2017 | Dissertation | LibreCat-ID: 9986 |
Modellbasierte Mehrzieloptimierung zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen
A. Unger, Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen, Universität Paderborn, 2017.
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A. Unger, Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen, Universität Paderborn, 2017.
2016 | Conference Paper | LibreCat-ID: 9955
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
LibreCat
| DOI
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
2016 | Journal Article | LibreCat-ID: 9957
Kupferbondverbindungen intelligent herstellen
M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
LibreCat
M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
LibreCat
| DOI
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
2016 | Conference Paper | LibreCat-ID: 9960
Micro Wear Modeling in Copper Wire Wedge Bonding
P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.
LibreCat
P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.
2016 | Conference Paper | LibreCat-ID: 9966
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
LibreCat
| DOI
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
LibreCat
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
2016 | Book Chapter | LibreCat-ID: 29778
Positive Beispiele zu negativen Zahlen – Unterrichtsstudien zum Mathematikunterricht. Abschlussbericht
P.G. Althoff, R. Friedli, M. Hattermann, R. Vom Hofe, H. Kullmann, F. Viehmeister, in: N. Freke, H. Kullmann, F. Lücker, B. Lütje-Klose, S. Schwab, A. Textor, C.T. Zenke (Eds.), Laborschulforschung 2016. Berichte Und Anträge Zum Forschungs- Und Entwicklungsplan. Werkstattheft Nr. 52, {Wissenschaftliche Einrichtung Laborschule an der Universität Bielefeld}, Bielefeld, 2016, pp. 11–87.
LibreCat
P.G. Althoff, R. Friedli, M. Hattermann, R. Vom Hofe, H. Kullmann, F. Viehmeister, in: N. Freke, H. Kullmann, F. Lücker, B. Lütje-Klose, S. Schwab, A. Textor, C.T. Zenke (Eds.), Laborschulforschung 2016. Berichte Und Anträge Zum Forschungs- Und Entwicklungsplan. Werkstattheft Nr. 52, {Wissenschaftliche Einrichtung Laborschule an der Universität Bielefeld}, Bielefeld, 2016, pp. 11–87.
2016 | Conference Paper | LibreCat-ID: 38259
Accelerated Testing of Polarization-Tracking Receiver Using Polarization Scrambler with Peaked Speed Distribution
B. Koch, R. Noé, V. Mirvoda, D. Sandel, in: Photonic Networks; 17. ITG-Symposium; Proceedings Of, 2016, pp. 1–3.
LibreCat
B. Koch, R. Noé, V. Mirvoda, D. Sandel, in: Photonic Networks; 17. ITG-Symposium; Proceedings Of, 2016, pp. 1–3.
2015 | Conference Paper | LibreCat-ID: 9943
Improving the cleaning process in copper wire bonding by adapting bonding parameters
S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.
LibreCat
| DOI
S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.
2015 | Conference Paper | LibreCat-ID: 9951
Modeling and simulation of the ultrasonic wire bonding process
T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.
LibreCat
| DOI
T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.